Electronic devices containing organic semiconductor materials

ABSTRACT

An electronic device includes first and second electrical contacts electrically coupled to a semiconductor polymer film, which includes mono-substituted diphenylhydrazone.

BACKGROUND Description of the Art

Over the past few years, the demand for ever cheaper and lighter weightportable electronic devices such as cell phones, personal digitalassistants, portable computers, smart credit and debit cards hasincreased dramatically. This has led to a growing need to manufacturedurable, lightweight, and low cost electronic circuits. The ability tofabricate such circuits is typically constrained by the need to utilizesilicon-based semiconductors and processing.

Currently the fabrication of semiconducting circuits on polymersubstrates, especially on flexible polymer substrates, is hindered bythe typical harsh processing conditions for silicon-based devices suchas high temperatures. Most polymer substrates have a relatively lowmelting or degradation temperature when compared to the deposition orannealing temperatures utilized in semiconductor processing. Thus, thesemiconductor circuit elements are typically fabricated on semiconductorsubstrates such as single crystal silicon, and then separately mountedon the polymer substrate, requiring further interconnections, processingand cost.

One technique utilized to circumvent the lack of mechanical flexibilityinherent in silicon-based devices is to use ultra thin flexible singlecrystal silicon wafers. However, this technique suffers from both theexpense associated with the manufacture of such ultra thin wafers aswell as the fragility problems associated with the handling of suchwafers and dies.

Another methodology utilized to get around the need for wafer levelprocessing is the use of amorphous silicon-based thin film transistors(TFTs). However, this technology generally requires processingtemperatures in the range of 300° C. to 400° C. that typically resultsin the melting or severe degradation of most polymer substrates.

There are a number of other problems in fabricating semiconductingcircuits on polymer substrates. In general, only a limited number ofpolymers, such as polyimides, are available that can withstand thetemperatures utilized in fabricating silicon semiconducting circuits. Inaddition, compatibility can be an issue; for example the difference inthermal expansion between silicon and polymers is large, typicallyresulting in thermal stress that can affect device performance. Undersome conditions it can lead to delamination of the silicon from thepolymer substrate. Further, these polymers tend to have poor opticalqualities for display applications and are specialized polymers thattypically are expensive. The deposition of silicon typically requiressophisticated and expensive equipment that requires a vacuum and isoptimized for deposition on wafers. These problems render impracticalthe manufacture of durable, lightweight, and low cost electroniccircuits will remain impractical.

SUMMARY OF THE INVENTION

An electronic device includes first and second electrical contactselectrically coupled to a semiconductor polymer film, which includesmono-substituted diphenylhydrazone.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a two terminal electronic deviceaccording to an embodiment of this invention;

FIG. 2 a is a cross-sectional view of a two terminal electronic deviceaccording to an embodiment of this invention;

FIG. 2 b is a cross-sectional view of a two terminal electronic deviceaccording to an embodiment of this invention;

FIG. 3 is a cross-sectional view of a three terminal electronic deviceaccording to an embodiment of this invention;

FIG. 4 a is a cross-sectional view of a three terminal electronic deviceaccording to an embodiment of this invention;

FIG. 4 b is a cross-sectional view of a three terminal electronic deviceaccording to an embodiment of this invention;

FIG. 5 is a graph of the zero field hole mobility in cm² per volt secondas a function of UV exposure time in minutes according to an embodimentof this invention;

FIG. 6 a is a perspective view of a photosensitive programmable arrayaccording to an embodiment of this invention;

FIG. 6 b is a cross-sectional view of a logic cell according to anembodiment of this invention;

FIG. 6 c is a cross-sectional view of a photosensitive programmablearray according to an embodiment of this invention;

FIG. 7 is a flow chart of a method of fabricating an electronic deviceaccording to an embodiment of this invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1, an exemplary embodiment of a two terminal device ofthe present invention is shown in a cross-sectional view. In thisembodiment, electrical contacts 120 and 122 are formed on semiconductingpolymer film 110. The dopant material utilized in semiconducting polymerfilm 110 is a mono-substituted diphenylhydrazone compound (DPH) havingthe structure R1-CH═N—N(C6H6)2, and preferably R1 may be saturatedcarbon chains of from C1 to C6, unsaturated carbon chains of from C1 toC6, a cyclohexyl group, a cyclopentyl group, unsubstituted phenylgroups, substituted phenyl groups, unsubstituted benzyl groups,substituted benzyl groups, and mixtures thereof. More preferably, thedopant material is a di-substituted amino benzaldehyde diphenylhydrazonehaving the structure R2R3-N—C6H6-CH═N—N(C6H6)2 where R2 and R3 mayindependently be saturated carbon chains of from C1 to C6, unsaturatedcarbon chains of from C1 to C6, a cyclohexyl group, a cyclopentyl group,unsubstituted phenyl groups, substituted phenyl groups, unsubstitutedbenzyl groups, substituted benzyl groups, and mixtures thereof.Particularly preferable is the compound p-(diethylamino) benzaldehydediphenylhydrazone.

Preferably, the dopant material is added to a binder material in therange from about 10 weight percent to about 80 weight percent DPH, andmore preferably from about 20 weight percent to about 50 weight percentof DPH. The thickness of semiconducting polymer film 110 is in the rangefrom about 0.1 microns to about 25 microns, and preferably in the rangeof about 1 micron to 15 microns. However, depending upon electricalcharacteristics desired and the particular application of the deviceother thicknesses may be utilized.

As shown in FIG. 1, the exposure of semiconducting polymer film 110 toUV radiation can be utilized to tune the conductivity of semiconductingpolymer film 110 to a particular value. Preferably, electrical contacts120, and 122 are UV absorbent materials that may act as a self alignedmask for the UV exposure, however, any of the other standard techniquessuch as shadow masks, lasers, or photolithographic methods may also beutilized to expose selective areas.

The binder or matrix polymer for semiconducting film 110 may be selectedfrom polycarbonate, polyester, polystyrene, polyvinylchloride,polymethylmethacrylate, polyvinyl acetate, vinylchloride/vinylacetatecopolymers, acrylic resin, polyacrylonitrile, polyamide, polyketones,polyacrylamide, and other similar materials. The material chosen for thebinder will depend on the particular electrical characteristics desired,processing conditions, as well as the environmental conditions in whichthe device will be utilized. However, for most applications, preferably,the binder is a polycarbonate, polystyrene, or polyester, and morepreferably the binder is a polycarbonate. An exemplary binder materialis a bisphenol-A-polycarbonate with a number average molecular weight(Mn) in the range from about 5,000 to about 50,000, more preferably fromabout 30,000 to about 35,000 and a polydispersity index of below about2.5. An example of a commercially available polycarbonate that can beused as a binder or matrix polymer is a bisphenol-A-polycarbonateavailable from The Bayer Group under the trademark “MAKROLON-5208” thathas an Mn of about 34,500 and a polydispersity index of about 2.

Electrical contacts 120 and 122 may be a metal layer, preferably,selected from gold, chromium, aluminum, indium, tin, lead, antimony,platinum, titanium, tungsten, tantalum, silver, copper, molybdenum, andsimilar metals as well as combinations thereof. In this embodiment,electrical contacts 120 and 122 may also be formed from conductivematerials such as polyaniline, polypyrrole, pentacene, anthracene,napthacene, phenanthrene, pyrene, thiophene compounds, conductive ink,and similar materials. The material chosen for the electrical contactswill depend on the particular electrical characteristics desired,processing conditions, as well as the environmental conditions in whichthe device will be utilized. However, for most applications, preferably,the electrical contacts are formed from polyaniline or thiophenecompounds such as poly (3,4-ethylene dioxythiophene) (PEDOT) orcamphorsulfonic acid doped polyaniline.

The thickness of the electrical contacts is preferably in the range fromabout 0.01 microns to about 1.0 micron, however, depending uponcharacteristics desired both thicker and thinner contacts may beutilized. These metals and conductive materials as well as thicknessranges can also be utilized as the electrical contacts in the alternateembodiments described and shown below.

An alternate embodiment of the present invention is shown in across-sectional view in FIG. 2 a. In this embodiment, semiconductingpolymer film or layer 210 is created over substrate 230. Electricalcontacts 220 and 222, are electrically coupled to semiconducting polymerfilm 210 as shown in FIG. 2 a, and are created in substrate 230.However, electrical contacts 220 and 222 can also be created onsubstrate 230, and may be created from any of the metals or conductivematerials, as described above, for the embodiment shown in FIG. 1. Inaddition, electrical contacts 220 and 222 may be formed on top ofsemiconductor polymer layer 210 (not shown) and thus, may act as a selfaligned mask for the UV exposure as described above. Passivation layer250 is created over semiconductor polymer film 210 and protectssemiconductor polymer film from damage and environmental degradation. UVtransmitting window 240 is created over a portion of semiconductingpolymer film 210 providing the ability to tune the conductivity ofsemiconducting polymer film 210 to a particular value.

Substrate 230 may be formed from a wide variety of materials such assilicon, gallium arsenide, glass, ceramic materials, and harder, morebrittle plastics may all be utilized. In addition, metals and alloys canalso be utilized. In particular, metals such as aluminum and tantalumthat electrochemically form oxides, such as anodized aluminum ortantalum, can be utilized. Preferably, substrate 230 is created from aflexible polymer material such as polyimide, polyester (PET),polyethylene naphthalate (PEN), as polyvinyl chloride, polybutyleneterephthalate (PBT), polyethylene naphthalate (PEN), polypropylene (PP),polyethylene (PE), polyurethane, polyamide, polyarylates, and polyesterbased liquid-crystal polymers to name a few. More preferably, substrate230 is formed from PET or PEN. The thickness of substrate 230 preferablyranges from about 5 to about 500 microns and more preferably from about5 to about 50 microns thick and particularly preferable is a range fromabout 10 to about 25 microns thick.

UV transmitting window 240 can be created from any material having atleast a 75 percent transmittance in the wavelength region from about 250nm to about 500 nm. Preferably UV transmitting window 240 is createdfrom indium tin oxide, silicon dioxide, polycarbonate, polystyrene orcombinations thereof. The thickness of UV transmitting window 240,preferably, is in the range from about 0.5 microns to about 1.0 micron;however, other thicknesses can be utilized depending on the particularapplication of the circuit.

Passivation layer 250 can be created from a material having less thanabout 15 percent transmittance in the wavelength region from about 250nm to about 500 nm. Preferably passivation layer 250 has a transmittanceof less than 5 percent in the above described wavelength region.Passivation layer 250, preferably, is formed from any of a wide range ofpolymeric materials such as polyimide, polyetherimides, polybutyleneterephthalate, polyester, polyethylene naphthalate (PEN), or epoxy, toname a few. If electrical contacts 220 and 222 are formed to act as aself aligned mask for the UV exposure, as described above, thenpassivation layer 250 may be formed from the same material as UVtransmitting window 240.

An alternate embodiment of the present invention is shown in across-sectional view in FIG. 2 b. In this embodiment, two semiconductingpolymer films or layers 210 and 210′ are created on substrate 230′.Semiconducting polymer layer 210 is formed on a first side of substrate230′ analogous to the structures described above and shown in FIG. 2 a.Electrical contacts 220 and 222 are electrically coupled tosemiconducting polymer layer 210 and passivation layer 250 and UVtransmitting window 240 are formed over semiconducting polymer layer210.

In addition, in this embodiment a second semiconducting polymer layer210′ is formed on a second side of substrate 230′ as shown in FIG. 2 b.Electrical contacts 220′ and 222′ are electrically coupled tosemiconducting polymer layer 210′ and passivation layer 250′ and UVtransmitting window 240′ are formed over semiconducting polymer layer210′. The structure, properties and materials utilized in the previousembodiments described above can be utilized in this embodiment as well.

Referring to FIG. 3, an exemplary embodiment of a three terminal deviceof the present invention is shown in a cross-sectional view. In thisembodiment, electrical contacts 320 and 322 are formed on, andelectrically coupled to, semiconducting polymer film 310. In addition,electrical contact 326 is electrically coupled to semiconducting polymerfilm 310 via insulator 360 that is in contact with semiconductingpolymer film 310. Semiconducting polymer film 310 utilizes the dopantDPH. Insulator 360 is a dielectric material, preferably a polymer thatis non-polar, and more preferably polystyrene. However, other polymerssuch as polycarbonate, polyethylene, polypropylene, and polyvinylphenolas well as metal oxides and carbides, to name just a few, may also beutilized. In addition, the materials and properties described above forthe semiconducting polymer layer utilized in the two terminal device maybe utilized in this embodiment. Further, the structures, properties andmaterials for the electrical contacts described above in the twoterminal device can also be utilized in this embodiment for the threeterminal device.

As shown in FIG. 3, the exposure of semiconducting polymer film 310 toUV radiation can be utilized to tune the conductivity of semiconductingpolymer film 310 to a particular value. Preferably, electrical contacts320, and 322 are UV absorbent materials that may act as a self-alignedmask for the UV exposure; however, other standard techniques such asshadow masks or photolithographic methods may also be utilized to exposeselective areas.

An alternate embodiment of a three terminal device of the presentinvention is shown in a cross-sectional view in FIG. 4 a. In thisembodiment, electrical contact 426 is formed on substrate 430 andinsulator 460 is created at least over electrical contact 426 and may beformed as a layer over substrate 430. Electrical contacts 420 and 422are created on insulator 460, with semiconducting polymer film 410formed over electrical contacts 420 and 422, and insulator 460 as shownin FIG. 4 a. Passivation layer 450 and UV transmitting window 440 arecreated over semiconducting film 410 as described, for the two terminaldevice, above and shown in FIG. 2 a. Another structure that may beutilized is one in which electrical contacts 420 and 422 are createdover semiconducting film 410 (not shown) and thus, may act as a selfaligned mask for the UV exposure as described above.

An alternate embodiment of a three terminal device of the presentinvention is shown in a cross-sectional view in FIG. 4 b. In thisembodiment, two semiconducting polymer films or layers 410 and 410′ arecreated on substrate 430′. Semiconducting polymer layer 410 is formed ona first side of substrate 430′ analogous to the structures describedabove and shown in FIG. 4 a. Electrical contact 426 is formed onsubstrate 430′ and insulator 460 is created at least over electricalcontact 426 and may be formed as a layer over substrate 430′. Electricalcontacts 420 and 422 are created on insulator 460, with semiconductingpolymer film 410 formed over electrical contacts 420 and 422, andinsulator 460 as shown in FIG. 4 a. Passivation layer 450 and UVtransmitting window 440 are created over semiconducting film 410 asdescribed, for the two terminal device, above and shown in FIG. 2 a.Another structure that may be utilized is one in which electricalcontacts 420 and 422 are created over semiconducting film 410 (notshown) and as described above.

In addition, in this embodiment a second semiconducting polymer layer410′ is formed on a second side of substrate 430′ as shown in FIG. 4 b.Electrical contact 426′ is electrically coupled to semiconductor polymerlayer 410′, and is formed on substrate 430′. Insulator 460′ is createdat least over electrical contact 426′ and may be formed as a layer oversubstrate 430′. Electrical contacts 420′ and 422′ are electricallycoupled to semiconducting polymer layer 410′, and passivation layer 450′and UV transmitting window 440′ are formed over semiconducting polymerlayer 410′. The structure, properties and materials utilized in theprevious embodiments described above can be utilized in this embodimentas well.

The change in the zero field hole mobility in cm² per volt second as afunction of UV exposure time in minutes is graphically shown in FIG. 5.The semiconducting polymer film was exposed using a medium pressure 450Watt mercury vapor lamp, although other sources of UV light could beused. The semiconducting polymer film used to obtain the data for FIG. 5was prepared by dissolving 41 weight percent of N,N-diethylaminobenzaldehyde-1,1-diphenylhydrazone (DEH) and bisphenol-A-polycarbonatein HPLC grade tetrahydrofuran. Samples were then prepared by solventcoating the above solution onto semitransparent aluminized PETsubstrates. The coated substrates were oven dried, in air, at 100 C. forone hour to reduce residual solvent content. Electrical contacts werecreated using an electron beam evaporation process. The gold contactswere approximately 1 cm. in diameter and about 0.5 microns thick. Theaverage film thickness of the semiconducting polymer film was about 11.0microns. As the exposure time is increased, more and more DEH moleculesare photoconverted, thereby effectively removing DEH molecules from thecharge transport process, resulting in a decrease in the holeconductivity in the molecularly doped polymeric circuit element. Asshown in FIG. 5, UV exposure results in a decrease of approximatelythree orders of magnitude in the charge mobility of the semiconductorpolymer film. The decrease in conductivity, generated by exposure to UVlight, can be reversed by heating the sample above the glass transitiontemperature of the binder material utilized in the semiconductor polymerfilm.

Referring to FIG. 6 a, an exemplary embodiment of a photosensitiveprogrammable array of the present invention is shown in a perspectiveview. In this embodiment, semiconducting polymer film 610 forms afunctional medium having a non-linear impedance characteristic. On thetop surface, also referred to as the first side, of semiconductingpolymer film 610, a plurality of electrical conductors 670 are formedand are denoted as U_(j). Electrical conductors 670 are substantiallyparallel to each other. On the bottom surface, also referred to as thesecond side, of semiconducting polymer film 610 are formed acorresponding plurality of electrical conductors 672 that aresubstantially parallel to each other and are substantially mutuallyorthogonal to electrical conductors 670. The electrical conductors 672are denoted as C_(i). The combination of electrical conductors 670 and672 form a planar orthogonal x, y matrix. Logic cell 675 is formed inthe volume between any two intersecting electrical conductors.

A more detailed cross-sectional view of logic cell 675 is shown in FIG.6 b. In this embodiment, electrical conductor 670′ is an electricallyconductive material having at least a 75 percent transmittance in thewavelength region from about 250 nm to about 500 nm such as indium tinoxide. Electrical conductor 672 may be formed from any of theelectrically conductive materials for the two and three terminal devicesdescribed above. Semiconducting polymer film 610 is also formed from anyof the materials described above for the semiconductor layer utilized intwo and three terminal devices.

As described earlier (see FIG. 5) the exposure of semiconducting polymerfilm 610 will result in a decrease in conductivity. Thus, by selectivelyexposing the volume of the semiconductor polymer film between any twointersecting electrical conductors, the conductivity of a logic cell canbe reduced. The change in conductivity depends on the time of exposureto UV radiation. The electrical conductivity of the exposed volume ofsemiconducting polymer changes state from conductive to substantiallynon-conductive. Such a resultant change can be a difference of up tothree orders of magnitude or more in conductivity, as shown in FIG. 5,whereby the photoconversion process produces a high resistance bridge oropen link. The selective exposure of various logic cells to UV radiationis preferably by laser pulses; however, any of the other standardtechniques such as shadow masks or photolithographic methods may also beutilized to expose selective cells. An array of passive logic cells canbe formed that are either in a conductive or non-conductive staterepresenting a 0 or 1. In addition, the present invention also enablesthe ability to restore a non-conductive logic cell, that was exposed toUV radiation, to a conductive state by heating the volume of thesemiconductor polymer film above the glass transition temperature of thebinder material utilized. This heating operation can preferably beperformed using a laser pulse, although other heating techniques canalso be utilized.

An alternate embodiment of the present invention is shown in across-sectional view in FIG. 6 c. In this embodiment, two semiconductingpolymer films or layers 610 and 610′ are created on substrate 630′. Aplurality of electrical conductors 672 are electrically coupled to thebottom surface of semiconducting layer 610 and are formed on the firstside of substrate 630. However, the plurality of electrical conductors672 may also be created on substrate 630, and may be created from any ofthe metals or conductive materials as described above. On the topsurface of semiconducting polymer film 610 a plurality of electricalconductors 670 are formed and are substantially mutually orthogonal toelectrical conductors 672.

A plurality of electrical conductors 672′ are electrically coupled tothe bottom surface of semiconducting layer 610′ and are formed on thesecond side of substrate 630. However, the plurality of electricalconductors 672′ may also be created on substrate 630, and may be createdfrom any of the metals or conductive materials as described above. Onthe top surface of semiconducting polymer film 610′ a plurality ofelectrical conductors 670′ are formed and are substantially mutuallyorthogonal to electrical conductors 672′. Such a dual layerphotosensitive programmable array provides on the order of 5.0 Gbits/cm2using traditional lithographic technologies for patterning and creatingthe electrical conductors. Patterning of the semiconductor polymer layer610 and 610′ is not required to achieve this bit density.

A method of manufacturing an electronic device utilizing asemiconducting layer including DPH is shown as a flow diagram in FIG. 7.Although the description will describe the process utilized to fabricatea single layer device on one side of the substrate, the process used toform a dual layer structure, as shown in FIGS. 2 b, 4 b, and 6 c, isaccomplished by repeating the steps described on the second side of thesubstrate. In step 702 a semiconducting polymer layer including DPH iscreated. The particular binder chosen will depend, for example, on theparticular electronic properties desired, the environment in which thedevice will be used, whether a two or a three terminal device or aprogrammable array or some combination thereof will be utilized.Depending on the particular binder chosen the appropriate solvents areutilized that provide sufficient solubility for both the binder and theDPH as well as providing appropriate viscosity for the particularcoating or casting process chosen. An exemplary process for creating asemiconductor polymer layer uses HPLC grade tetrahydrofuran as a solventto dissolve the binder bisphenol-A-polycarbonate and the DPH inappropriate concentrations to obtain the desired electrical properties.If a substrate is utilized, as shown, for example, in FIGS. 2 a and 2 b,then the composition and properties of the substrate are also taken intoconsideration, in order to obtain good adhesion between the substrateand the semiconductor polymer layer.

The creation of electrical contacts is accomplished in step 704.Depending on the particular material chosen to generate the electricalcontact this step may consist of sputter deposition, electron beamevaporation, thermal evaporation, or chemical vapor deposition of eithermetals or alloys. Conductive materials such as polyaniline, polypyrrole,pentacene, thiophene compounds,or conductive inks, may utilize any ofthe techniques used to create thin organic films may be utilized. Forexample, screen printing, spin coating, dip coating, spray coating, inkjet deposition and in some cases, as with PEDOT, thermal evaporation aretechniques that may be used. Depending on the particular electronicdevice being fabricated, the electrical contacts may be created eitheron a substrate or directly on the semiconducting polymer film.Patterning of the electrical contacts is accomplished by any of thegenerally available photolithographic techniques utilized insemiconductor processing. However, depending on the particular materialchosen, other techniques such as laser ablation or ink jet depositionmay also be utilized. In addition, combinations of different conductivematerials may also be utilized that might result in very differentprocesses being utilized. For example in a programmable array it may bedesirable to utilize PEDOT as the material for the lower electricaltraces and indium tin oxide for the upper UV transmitting electricaltraces.

In step 706 a passivation layer is created to protect the semiconductorpolymer film from damage and environmental degradation when appropriate.Any of the techniques mentioned above for the creation of the electricalcontacts may also be utilized to create the passivation layer. Inaddition to those techniques, any of the techniques utilized to createdielectric materials and films may also be utilized as well astechniques such as lamination and casting.

The creation of an UV transmitting window to enable photoconversion ofthe DPH molecules is accomplished in step 708 when appropriate. Any oftechniques mentioned above for creation of the passivation layer orelectrical contacts may also be utilized to create the UV transmittingwindow depending on the particular material chosen for the window. Forexample, if the UV transmitting window is a polycarbonate material, thencasting, spin coating, or screen printing are just a few examples of theprocesses that can be used to create the window. However, if forexample, silicon dioxide is used as the window material then spincoating of a spin on glass material or sputter deposition or chemicalvapor deposition may be utilized.

1. A method of fabricating an electronic device, comprising the step ofcreating a first electrical contact and a second electrical contact on afirst semiconducting polymer film, which includes mono-substituteddiphenyihydrazone (DPH).
 2. The method of claim 1, further comprisingthe steps of: creating a first insulator layer in contact with saidfirst semiconducting polymer layer; and creating a third electricalcontact on said first insulator layer.
 3. The method of claim 2, whereinsaid step of creating a first electrical contact and a second electricalcontact further comprises the step of depositing a first electricalcontact and a second electrical contact utilizing an ink jet depositionsystem.
 4. The method of claim 2, wherein said step of creating a thirdelectrical contact further comprises the step of depositing a thirdelectrical contact utilizing an ink jet deposition system.
 5. The methodof claim 1, further comprising the step of creating a first passivationlayer over a portion of said first semiconducting polymer layer.
 6. Themethod of claim 1, further comprising the step of creating a firstultraviolet window over a portion of said first semiconducting polymerlayer.
 7. The method of claim 1, further comprising the step of creatinga substrate, having a first side and a second side wherein said firstelectrical contact, said second electrical contact, and said firstsemiconducting polymer layer are formed over said first side of saidsubstrate.
 8. The method of claim 7, further comprising the step ofcreating a fourth electrical contact and a fifth electrical contact on asecond semiconducting polymer film, which includes mono-substituteddiphenylhydrazone (DPH), formed over said second side of said substrate.9. The method of claim 8, further comprising the steps of: creating asecond insulator layer in contact with said second semiconductingpolymer layer; and creating a sixth electrical contact on said secondinsulator layer.
 10. The method of claim 8, further comprising the stepof creating a second passivation layer over a portion of said secondsemiconducting polymer layer.
 11. The method of claim 8, furthercomprising the step of creating a second ultraviolet window over aportion of said second semiconducting polymer layer.
 12. A method offabricating an electronic device, comprising: creating a firstelectrical contact and a second electrical contact on and electricallycoupled to a first semiconducting polymer film, said firstsemiconducting polymer film having: a polymer binder, andmono-substituted diphenyihydrazone (DPH) dispersed in said polymerbinder; and creating a first ultraviolet window over a portion of saidfirst semiconducting polymer layer.